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Chinese Semiconductor Equipment Manufacturers Draw in New Investment

Chinese Semiconductor Equipment Manufacturers Draw in New Investment

2026-03-30
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Samsung Reportedly Eyes Long-Term Memory Deals with Google, Microsoft; May Include $10B+ Prepayments

Samsung Reportedly Eyes Long-Term Memory Deals with Google, Microsoft; May Include $10B+ Prepayments

2026-03-24
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NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flash

NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flash

2026-03-09
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AI Power Demand Drives HVDC Shift in Data Centers; Full-Stack Integration Emerges as Key

AI Power Demand Drives HVDC Shift in Data Centers; Full-Stack Integration Emerges as Key

2026-03-04
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SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration

SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration

2026-02-25
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Flexible AI Chip Integrating 10,628 Transistors Debuts, Paving the Way for Bendable Intelligence

Flexible AI Chip Integrating 10,628 Transistors Debuts, Paving the Way for Bendable Intelligence

2026-02-09
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DeepSeek Moves Closer to NVIDIA H200 Chips as China Reportedly Signals Conditional Approval

DeepSeek Moves Closer to NVIDIA H200 Chips as China Reportedly Signals Conditional Approval

2026-02-04
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Samsung’s Custom HBM4E Design Reportedly Aimed for Mid-2026, Parallels SK hynix and Micron

Samsung’s Custom HBM4E Design Reportedly Aimed for Mid-2026, Parallels SK hynix and Micron

2026-01-26
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