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China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei

China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei

2025-09-29
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AI Fuels High-Speed Interconnects, NVIDIA, Google, AWS Boost Optical Transceiver Module Demand

AI Fuels High-Speed Interconnects, NVIDIA, Google, AWS Boost Optical Transceiver Module Demand

2025-09-22
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What Comes After HBM? NAND-Stacked HBF May Power AI’s Future

What Comes After HBM? NAND-Stacked HBF May Power AI’s Future

2025-09-15
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SK hynix May Secure NVIDIA HBM4 Deal by Sep., Samsung Reportedly Trails in Testing

SK hynix May Secure NVIDIA HBM4 Deal by Sep., Samsung Reportedly Trails in Testing

2025-09-08
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U.S. Revokes China Chipmaking Tool Licenses for Samsung, SK hynix: Decoding Market Impact

U.S. Revokes China Chipmaking Tool Licenses for Samsung, SK hynix: Decoding Market Impact

2025-09-01
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SK hynix Unveils World’s First 321-Layer QLC NAND, Targets 1H26 Commercial Launch

SK hynix Unveils World’s First 321-Layer QLC NAND, Targets 1H26 Commercial Launch

2025-08-25
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NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets

NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets

2025-08-18
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Micron Reportedly Cuts Over 300 Jobs in China Amid Mobile NAND Retreat

Micron Reportedly Cuts Over 300 Jobs in China Amid Mobile NAND Retreat

2025-08-14
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